EATON Bussmann


EATON Bussmann is former Cooper Bussmann.

Cooper Bussmann is a wholly owned division of Cooper Industries, Inc (NYSE: CBE) and is headquartered in St. Louis, Missouri. With a more than 90-year history of innovation, Cooper Bussmann has set the standard for circuit protection in the global market. 

Cooper Bussmann manufactures a wide variety of North American and European-styled fuses for the electrical, electronics and transportation industries, plus inductors and transformers for power quality in electronic applications. Cooper Bussmann also offers engineering, training and testing services focused on downtime reduction, workplace safety and Code compliance. 

In 2007, Cooper Bussmann unveiled its new Cooper InVision Downtime Reduction System which, through a wireless mesh technology, notifies designated maintenance personnel in an open circuit event with the circuit's exact location, the correct replacement fuse, and appropriate level of personal protective equipment (PPE).

Markets Served
Cooper Bussmann serves four basic markets:
  • Electrical
    • Industrial MRO
    • OEM
    • Construction/Contractor
  • Electronics
  • Transportation
  • Consumer/Aftermarket
Cooper InVision? Src=

The new Cooper InVision Downtime Reduction System was introduced in 2007.

Cooper bussmann's Products

Cooper bussmann manufactures more than 50,000 SKUs (Stock Keeping Units) to provide customers with greater selection:

  • Low Voltage, Branch Circuit Rated Fuses
  • Low Voltage Supplementary Fuses
  • Electronic - Printed Circuit Board and Small Dimension Fuses
  • Medium Voltage Fuses
  • High Speed Fuses
  • IEC & British Standard Fuses
  • Fuse Holders and Blocks
  • Power Distribution Blocks
  • Wire Connection Products
  • Disconnects
  • Telecom Protection Devices
  • Surge Suppression Devices
  • Magnetics
  • Overvoltage Products
  • Supercapacitors
  • Accessories

Cooper Bussmann
engineering, training and testing services were introduced in 2005.


You'll find Cooper Bussmann fuses throughout industry,but also in the:

  • Gateway Arch, St. Louis
  • Sears Tower & John Hancock Building, Chicago
  • World's largest hydroelectric plant located between Brazil and Paraguay
  • New York Transit Authority subway trains
  • Walt Disney World monorail trains
  • NASA space shuttle and Mars lander
  • AOL/Time Warner Building, New York City

The Cooper Bussmann
Vehicle Electrical Center (VEC) power distribution module uses a patented programmable3D matrix technology.

Cooper bussmann's Manufacturing Facilities

Globally, Cooper Bussmann operates 12 manufacturing facilities. They include:


  • Dongguan, China
  • Hong Kong, China
  • Shanghai, China
  • Pondicherry, India
  • Seoul, South Korea

  • Burton-on-the-Wolds, England, UK
  • Copenhagen, Denmark

    North America
  • Dublin, California, USA
  • El Paso, Texas, USA
  • Goldsboro, North Carolina, USA
  • St. Louis, Missouri, USA

    South America
  • Ito, Brazil
Cooper Bussmann?Coiltronics? Src=

Juarez, Mexico Facility

Cooper bussmann's History
  • 1914 -Cooper bussmann founded by brothers Al, Frank, Joe, Harry and Lee Bussmann in St. Louis, Missouri.
  • 1929 -Cooper bussmann acquired by Max McGraw, (later McGraw Edison). The Bussmann family remains active.
  • 1979 -Cooper bussmann moves its headquarters and manufacturing to its current location in Ellisville, Missouri, a St. Louis suburb.
  • 1985 -McGraw Edison acquired by Cooper Industries, Inc.
  • 1993 -Cooper Bussmann opens the Paul Gubany Center for High Power Technology.

Cooper bussmann's ounders:  Al, Frank, Joe, Harry and Lee Bussmann.

Cooper Bussmann Patent History

In its more than 90-year history, Cooper Bussmann has received more than 3000 utility and design patents, with more than 150 patents currently active.

  • 1923 -Harry is awarded the first two patents for cartridge and electric fuses.
  • 1924 -Frank receives a portable electric lamp patent.
  • 1929 -Fusetron fuse technology patented.
  • 1963 -Cooper bussmann receives a patent for its Class J time-delay fuse design.
  • 1967 -The patented Low-Peak fuse product line is introduced.
  • 1992 -The patented LPCC midget time-delay fuse is introduced.
  • 1993 -Cooper Bussmann introduces and receives a patent for surface-mount chip fuses used on printed circuit boards.
  • 2000 -The finger-safe CUBEFuse device receives five patents.
Cooper Bussmann?CUBEFuse? Src=

The Cooper Bussmann  
IP20 finger-safe CUBEFuse
is now available up to 100A.